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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SDR6603-3R3M
- Part Number SDR6603-3R3M
- Manufacturer Bourns
- Last Modified Date Nov 25, 2020 2:08 PM UTC
- Pinout / Pin List Click Here (Member Only)
SDR6603-3R3M Details
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Manufacturer Part Number:
SDR6603-3R3M
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Factory Lead Time:
16 Weeks
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Manufacturer:
Bourns Inc
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YTEOL:
7.6
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Case/Size Code:
2618
SDR6603-3R3M Frequently Asked Questions (FAQs)
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The recommended land pattern for the SDR6603-3R3M can be found in the Bourns Application Note S-8153, which provides detailed information on land pattern design and layout considerations.
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To handle thermal considerations, ensure proper thermal management by providing adequate heat sinking, using thermal vias, and keeping the component away from heat sources. The thermal resistance of the device is specified in the datasheet, and it's essential to follow the recommended thermal design guidelines.
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The maximum operating temperature range for the SDR6603-3R3M is -40°C to +125°C, as specified in the datasheet. However, it's essential to note that the device's performance may degrade at higher temperatures, and derating may be necessary for reliable operation.
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The SDR6603-3R3M is designed to withstand moderate vibration levels, but it's essential to follow the recommended mounting and soldering guidelines to ensure reliable operation in high-vibration environments. Additionally, consider using vibration-resistant mounting options, such as adhesive or screw-mounted components.
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To ensure the SDR6603-3R3M meets your specific application's EMI requirements, follow the recommended layout and design guidelines, use proper shielding and grounding techniques, and consider using EMI filters or absorbers if necessary. Additionally, consult with Bourns' application engineers or EMI experts for customized guidance.
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SDR6603-3R3M Overview
Use the download button to access the SDR6603-3R3M 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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