SDT10A100CTFP footprint, schematic symbol and 3D model by Diodes Incorporated

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PCB Footprints

SDT10A100CTFP - Diodes Incorporated PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - ITO220AB (Type HE)

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3D Models

SDT10A100CTFP - Diodes Incorporated - 3D model - Transistor Outline, Vertical - ITO220AB (Type HE)

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Datasheet Download Datasheet
Stock & Prices Price & Stock for SDT10A100CTFP
Part Number SDT10A100CTFP
Manufacturer Diodes Incorporated
Pin Count 3
Part Category Schottky Diode
Package Category Transistor Outline, Vertical
Footprint Name Transistor Outline, Vertical - ITO220AB (Type HE)
Released Date May 22, 2026
Last Modified Date May 22, 2026 4:12 AM UTC
Pinout / Pin List Click Here (Member Only)

SDT10A100CTFP Details

Manufacturer Part Number:
SDT10A100CTFP
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Package Description:
ITO-220AB (TYPE HE), 3 PIN
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Factory Lead Time:
12 Weeks
Date Of Intro:
2016-12-19
Manufacturer:
Diodes Incorporated
YTEOL:
0
Additional Feature:
FREE WHEELING DIODE
Application:
FAST SOFT RECOVERY
Case Connection:
ISOLATED
Configuration:
COMMON CATHODE, 2 ELEMENTS
Diode Element Material:
SILICON
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
0.66 V
JEDEC-95 Code:
TO-220AB
JESD-30 Code:
R-PSFM-T3
JESD-609 Code:
e3
Non-rep Pk Forward Current-Max:
150 A
Number of Elements:
2
Number of Phases:
1
Number of Terminals:
3
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-55 °C
Output Current-Max:
5 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
FLANGE MOUNT
Peak Reflow Temperature (Cel):
260
Rep Pk Reverse Voltage-Max:
100 V
Reverse Current-Max:
50 µA
Surface Mount:
NO
Technology:
SCHOTTKY
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
THROUGH-HOLE
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30

SDT10A100CTFP Frequently Asked Questions (FAQs)

Diodes Incorporated recommends a PCB layout with a solid ground plane and a thermal relief pattern under the device to ensure optimal thermal performance. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for voltage and current, and to ensure proper heat sinking and thermal management. Additionally, consider using a thermistor or thermal sensor to monitor the device temperature.
The SDT10A100CTFP can withstand a maximum voltage stress of 1.5 times the rated voltage (150V) for a short duration (less than 1 second). However, it's recommended to operate the device within the specified voltage ratings to ensure long-term reliability.
To protect the device from EOS and ESD, use a TVS diode or a transient voltage suppressor in parallel with the device. Additionally, follow proper handling and storage procedures, and use an ESD wrist strap or mat when handling the device.
Diodes Incorporated recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 10-30 seconds. The device is compatible with both lead-free and lead-based soldering processes.

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SDT10A100CTFP Overview

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SDT10A100CTFP - Diodes Incorporated

SDT10A100CTFP Details

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