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SDT23C712L02 - Yageo Group

Description: Electrostatic Discharged Protection Devices (ESD), Protects two +12V to -7V lines, SOT-23 surface mount package

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PCB Footprints
SDT23C712L02 - Yageo Group PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23-1
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3D Models
SDT23C712L02 - Yageo Group  - 3D model - SOT23 (3-Pin) - SOT-23-1
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SDT23C712L02 Details

  • Manufacturer Part Number:

    SDT23C712L02

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 3 PIN

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    6.38

  • Breakdown Voltage-Min:

    7.5 V

  • Clamping Voltage-Max:

    20 V

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    400 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    12 V

  • Reverse Current-Max:

    20 µA

  • Reverse Test Voltage:

    7 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

SDT23C712L02 Frequently Asked Questions (FAQs)

  • The recommended land pattern for SDT23C712L02 is a rectangular pad with a size of 2.5mm x 1.25mm, with a solder mask clearance of 0.1mm.
  • To handle thermal considerations, ensure a good thermal connection to a heat sink or a thermal pad, and avoid overheating the component during soldering or operation.
  • The maximum operating temperature for SDT23C712L02 is 125°C, with a derating of 1.25% per °C above 85°C.
  • Yes, SDT23C712L02 is suitable for high-frequency applications up to 1 GHz, but ensure proper PCB layout and decoupling to minimize parasitic effects.
  • To ensure reliability in a humid environment, apply a conformal coating to the PCB, and follow proper storage and handling procedures to prevent moisture absorption.

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SDT23C712L02 Overview

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