Part Image

SDT30B100D1-13 - Diodes Incorporated

Description: Diode 100 V 30A Surface Mount TO-252-3 (DPAK) (Type TH) 120 µA -55°C ~ 175°C

Download SDT30B100D1-13 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
SDT30B100D1-13 - Diodes Incorporated PCB footprint - Other - Other - TO252 (DPAK)(Type TH)
click to zoom
3D Models
SDT30B100D1-13 - Diodes Incorporated  - 3D model - Other - TO252 (DPAK)(Type TH)
click to zoom

SDT30B100D1-13 Details

  • Manufacturer Part Number:

    SDT30B100D1-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-252 (TYPE TH), DPAK-3/2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    28 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    FAST SOFT RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.85 V

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    130 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    30 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    120 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

SDT30B100D1-13 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern around the thermal pad is suggested.
  • Ensure proper thermal management, follow recommended PCB layout, and consider derating the device's power handling at higher temperatures to prevent thermal runaway.
  • Handle the device with ESD-protective equipment and follow standard ESD handling procedures. The device has built-in ESD protection, but it's not a substitute for proper handling and storage.
  • The SDT30B100D1-13 is an industrial-grade device, but it's not specifically designed for high-reliability or automotive applications. Consult with Diodes Incorporated for customized solutions or alternative products.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 60s max. For rework, use a low-temperature soldering iron and avoid applying excessive heat or force.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

SDT30B100D1-13 Overview

Use the download button to access the SDT30B100D1-13 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SDT30, or try a keyword search, such as Rectifier Diodes

Parts related to SDT30B100D1-13

Showing 0 results