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SDT40A100CTFP - Diodes Incorporated

Description: Low Forward Voltage Drop  Excellent High Temperature Stability  Soft, Fast Switching Capability  Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Note 3)

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SDT40A100CTFP - Diodes Incorporated PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - ITO220AB (Type HE)
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SDT40A100CTFP - Diodes Incorporated  - 3D model - Transistor Outline, Vertical - ITO220AB (Type HE)
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SDT40A100CTFP Details

  • Manufacturer Part Number:

    SDT40A100CTFP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2016-12-21

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE

  • Application:

    FAST SOFT RECOVERY

  • Case Connection:

    ISOLATED

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.72 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    250 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    20 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    100 V

  • Reverse Current-Max:

    120 µA

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

SDT40A100CTFP Frequently Asked Questions (FAQs)

  • Diodes Incorporated recommends a PCB layout with a solid ground plane and a thermal relief pattern under the device to ensure optimal thermal performance. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves for voltage and current, and to ensure proper heat sinking and thermal management. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • The SDT40A100CTFP is designed to withstand voltage stress up to 120% of the rated voltage (400V) for a short duration (less than 1 second). However, it's recommended to follow the recommended operating conditions and avoid voltage stress to ensure long-term reliability.
  • While the SDT40A100CTFP is suitable for high-frequency switching applications, it's essential to consider the device's switching characteristics, such as turn-on and turn-off times, and ensure that the application's switching frequency is within the device's recommended operating range.
  • The gate resistor value depends on the specific application requirements, such as switching frequency, voltage, and current. A general guideline is to choose a gate resistor value between 10Ω and 100Ω. However, it's recommended to consult the application note or seek guidance from Diodes Incorporated's technical support team for specific guidance.

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SDT40A100CTFP Overview

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