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SE050B2HQ1/Z01SFZ - NXP

Description: Security ICs / Authentication ICs RSA, AES, 3DES

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PCB Footprints
SE050B2HQ1/Z01SFZ - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - HX2QFN20_2022
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3D Models
SE050B2HQ1/Z01SFZ - NXP  - 3D model - Quad Flat No-Lead - HX2QFN20_2022
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SE050B2HQ1/Z01SFZ Details

  • Manufacturer Part Number:

    SE050B2HQ1/Z01SFZ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    QFN-20

  • ECCN Code:

    5A992

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • JESD-30 Code:

    S-PQCC-N20

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.12SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.33 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.62 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • uPs/uCs/Peripheral ICs Type:

    CRYPTOGRAPHIC AUTHENTICATOR

SE050B2HQ1/Z01SFZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the chip. Refer to the NXP application note AN12270 for more details.
  • Implement secure boot by using the SE050's built-in secure boot mechanism, which verifies the authenticity of the firmware before booting. Use the NXP-provided secure boot tools and follow the guidelines in the SE050 datasheet and application notes.
  • The SE050B2HQ1/Z01SFZ operates within a temperature range of -40°C to 105°C. However, for optimal performance and reliability, it is recommended to operate within a temperature range of 0°C to 85°C.
  • Configure the SE050B2HQ1/Z01SFZ for I2C or SPI communication by setting the appropriate pins and registers according to the datasheet. For I2C, set the SCL and SDA pins, and for SPI, set the SCK, MOSI, and MISO pins. Refer to the SE050 datasheet and application notes for more details.
  • The SE050B2HQ1/Z01SFZ supports a maximum clock frequency of 100 MHz. However, the actual clock frequency may vary depending on the specific application and use case.

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SE050B2HQ1/Z01SFZ Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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