SF-0402F200-2 footprint, schematic symbol and 3D model by Bourns

Symbol

PCB Footprints

3D Models

SF-0402F200-2 Details

The recommended land pattern for the SF-0402F200-2 is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While the SF-0402F200-2 is rated for operation up to 125°C, it's essential to consider the derating curve and ensure that the component doesn't exceed its maximum operating temperature. Additionally, the soldering process and PCB material selection should be suitable for high-temperature applications.
To prevent damage, handle the SF-0402F200-2 by the edges or use a vacuum pickup tool. Avoid touching the component's leads or body, as the oils from human skin can cause soldering issues. Also, ensure that the PCB is clean and dry before assembly.
The recommended soldering profile for the SF-0402F200-2 is a peak temperature of 240°C ± 5°C, with a dwell time of 30-60 seconds above 217°C. This ensures proper solder wetting and minimizes the risk of thermal damage.
While the SF-0402F200-2 is designed to be reliable in normal operating conditions, it's not recommended for use in extremely humid or corrosive environments. If exposure to moisture or corrosive substances is unavoidable, consider using a conformal coating or potting compound to protect the component.

Community Provided

System Verified

Community Approved

Use the download button to access the SF-0402F200-2 schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like SF-04, or try a keyword search, such as Electric Fuses

If you searched for SF-0402F200-2, you might also be interested in these parts:

Showing 0 results


Please enter a minimum 3 letters or numbers
← Prev Next →