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SF-0402FP200F-2 - Bourns

Description: BOURNS - SF-0402FP200F-2 - FUSE, SMD, FAST ACTING, 2A, 0402

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Symbol
SF-0402FP200F-2 - Bourns - PCB symbol
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PCB Footprints
SF-0402FP200F-2 - Bourns PCB footprint - Fuses Chip - Fuses Chip - SF-0402
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3D Models
SF-0402FP200F-2 - Bourns - 3D model - Fuses Chip - SF-0402
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SF-0402FP200F-2 Details

  • Manufacturer Part Number:

    SF-0402FP200F-2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.10.00.40

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.78

  • Blow Characteristic:

    FAST

  • Body Breadth:

    0.51 mm

  • Body Height:

    0.33 mm

  • Body Length or Diameter:

    1 mm

  • Circuit Protection Type:

    ELECTRIC FUSE

  • Fuse Size:

    0402

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Temperature-Max:

    90 °C

  • Operating Temperature-Min:

    -55 °C

  • Packing Method:

    TR, 7 INCH

  • Rated Breaking Capacity:

    35 A

  • Rated Current:

    2 A

  • Rated Voltage(DC):

    35 V

  • Reference Standard:

    UL

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Trip Time or Delay:

    0.2 s

SF-0402FP200F-2 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SF-0402FP200F-2 is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape.
  • Yes, the SF-0402FP200F-2 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
  • Handle the SF-0402FP200F-2 by the edges to prevent damage to the component. Avoid touching the component's leads or body to prevent electrostatic discharge (ESD) damage.
  • Yes, the SF-0402FP200F-2 is designed to withstand vibrations up to 10 G's, making it suitable for use in high-vibration environments. However, it's recommended to follow proper mounting and soldering techniques to ensure the component's reliability.
  • The recommended soldering profile for the SF-0402FP200F-2 is a peak temperature of 260°C, with a dwell time of 10-30 seconds. It's recommended to follow the IPC-J-STD-020 standard for soldering electronic components.

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SF-0402FP200F-2 Overview

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