The recommended land pattern for SF-0402S400M-2 is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While SF-0402S400M-2 is rated for operation up to 125°C, it's essential to consider the derating curve and ensure that the component doesn't exceed its maximum operating temperature. Additionally, the soldering process and PCB material selection should be suitable for high-temperature applications.
During reflow soldering, it's crucial to follow the recommended reflow profile, which typically includes a peak temperature of 260°C and a dwell time of 20-30 seconds. Ensure that the component is properly aligned and secured to the PCB to prevent movement during the reflow process.
Store SF-0402S400M-2 in a dry, cool place, away from direct sunlight and moisture. Handle the components by the edges or body to prevent damage to the terminations. Avoid bending, flexing, or applying excessive force to the component.
While SF-0402S400M-2 is designed to operate in a variety of environments, it's essential to consider the component's moisture sensitivity level (MSL) and ensure that it's properly sealed or coated to prevent corrosion. Consult the datasheet and manufacturer's recommendations for specific guidance.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
SF-0402S400M-2 Overview
Use the download button to access the SF-0402S400M-2 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SF-04,
or try a keyword search, such as Electric Fuses
