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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SF-0603FP500M-2
- Part Number SF-0603FP500M-2
- Manufacturer Bourns
- Last Modified Date Dec 7, 2025 6:29 PM UTC
- Pinout / Pin List Click Here (Member Only)
SF-0603FP500M-2 Details
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Manufacturer Part Number:
SF-0603FP500M-2
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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ECCN Code:
EAR99
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HTS Code:
8536.10.00.40
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Factory Lead Time:
14 Weeks
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Manufacturer:
Bourns Inc
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YTEOL:
8
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Blow Characteristic:
FAST
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Body Breadth:
0.8 mm
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Body Height:
0.3 mm
SF-0603FP500M-2 Frequently Asked Questions (FAQs)
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The recommended land pattern for SF-0603FP500M-2 is a rectangular pad with a size of 0.65 mm x 0.65 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
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While SF-0603FP500M-2 is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the soldering process and PCB material selection should be suitable for high-temperature applications.
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To prevent ESD damage, handle SF-0603FP500M-2 components with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the PCB and assembly process also follow ESD-safe practices.
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The recommended soldering profile for SF-0603FP500M-2 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. This ensures proper solder wetting and minimizes the risk of thermal damage.
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While SF-0603FP500M-2 is a robust component, it's essential to consider the mechanical stress and vibration requirements of your application. Ensure that the component is properly secured to the PCB, and consider additional mechanical support or potting compounds if necessary.
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SF-0603FP500M-2 Overview
Use the download button to access the SF-0603FP500M-2 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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