SF-0603HIA100M-2 footprint, schematic symbol and 3D model by Bourns

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SF-0603HIA100M-2 Details

The recommended land pattern for SF-0603HIA100M-2 is a rectangular pad with a size of 0.65 mm x 1.25 mm, with a non-solder mask defined (NSMD) pad and a solder mask opening of 0.75 mm x 1.5 mm.
While the SF-0603HIA100M-2 is rated for operation up to 150°C, it's recommended to derate the component's power rating when operating in high-temperature environments. Consult the datasheet and Bourns' application notes for specific guidance.
Handle the SF-0603HIA100M-2 by the edges or body to prevent damage to the terminations. Avoid touching the component's leads or body with bare hands, as the oils from skin can cause damage. Use ESD-safe handling and storage procedures to prevent electrostatic discharge damage.
The recommended soldering profile for SF-0603HIA100M-2 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Consult the datasheet and Bourns' application notes for specific guidance on soldering profiles and techniques.
While the SF-0603HIA100M-2 is designed to operate in a variety of environments, it's recommended to take precautions when operating in humid or moist environments. Consider using conformal coating or other environmental protection methods to prevent moisture ingress and ensure reliable operation.

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