SF-0603S080-2 footprint, schematic symbol and 3D model by Bourns

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SF-0603S080-2 Details

The recommended land pattern for SF-0603S080-2 is a rectangular pad with a size of 0.8mm x 1.6mm, with a non-solder mask defined (NSMD) pad shape.
Yes, SF-0603S080-2 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to prevent overheating.
Handle the SF-0603S080-2 by the body, avoiding touching the leads or the ceramic element to prevent damage. Use a vacuum pickup or tweezers to handle the component during assembly and rework.
The recommended soldering profile for SF-0603S080-2 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. Ensure that the component is properly soldered to prevent thermal shock.
Yes, SF-0603S080-2 is designed to withstand high-vibration environments. However, it's essential to ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method.

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