SF-1206F100-2 footprint, schematic symbol and 3D model by Bourns

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SF-1206F100-2 Details

The recommended land pattern for SF-1206F100-2 is a rectangular pad with a size of 1.5 mm x 3.2 mm, with a non-solder mask defined (NSMD) pad shape.
Yes, SF-1206F100-2 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the component's performance and reliability may degrade at extreme temperatures.
Handle the component by the body, avoiding touching the leads or the ceramic element. Use a vacuum pickup or tweezers to handle the component during assembly and rework.
The recommended soldering profile for SF-1206F100-2 is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The component should be soldered using a solder with a melting point of 217°C or higher.
Yes, SF-1206F100-2 is designed to operate in humid environments, but it's recommended to follow proper PCB design and assembly guidelines to prevent moisture ingress and ensure reliable operation.

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