SF-1206F300-2 footprint, schematic symbol and 3D model by Bourns

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SF-1206F300-2 Details

The recommended land pattern for the SF-1206F300-2 is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
Yes, the SF-1206F300-2 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
Handle the SF-1206F300-2 by the edges or body to prevent damage to the component. Avoid touching the component's leads or pads to prevent contamination and electrical shock. Use a vacuum pickup or tweezers to handle the component during assembly and rework.
The recommended soldering profile for the SF-1206F300-2 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be completed within 3-5 minutes.
Yes, the SF-1206F300-2 is designed to withstand high-vibration environments. However, the component's performance and reliability may be affected by extreme vibration. It is recommended to follow the manufacturer's guidelines for vibration testing and to consult with a Bourns Inc. representative for specific application guidance.

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