SF-1206FP080-2 footprint, schematic symbol and 3D model by Bourns

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SF-1206FP080-2 Details

The recommended land pattern for SF-1206FP080-2 is a rectangular pad with a size of 1.5 mm x 3.5 mm, with a non-solder mask defined (NSMD) pad shape.
To handle thermal considerations, ensure a good thermal connection to a copper plane or a thermal via, and consider using a thermal interface material (TIM) to improve heat transfer.
The maximum operating temperature for SF-1206FP080-2 is 150°C, with a derating of 1.33% per °C above 125°C.
Yes, SF-1206FP080-2 is suitable for high-reliability applications, as it meets the requirements of AEC-Q200 and is manufactured with a robust design and high-quality materials.
To ensure reliability in a humid environment, consider using a conformal coating, and ensure that the component is stored in a dry environment with a relative humidity below 60%.

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