SF-1206FP100-2 footprint, schematic symbol and 3D model by Bourns

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SF-1206FP100-2 Details

The recommended land pattern for the SF-1206FP100-2 is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
Yes, the SF-1206FP100-2 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
To prevent damage, handle the SF-1206FP100-2 by the edges, avoid touching the component's leads or body, and use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD) damage.
The recommended soldering profile for the SF-1206FP100-2 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. A soldering iron with a temperature range of 350-400°F (175-200°C) is recommended.
Yes, the SF-1206FP100-2 is designed to withstand high-vibration and high-shock environments, with a vibration rating of 10-2000 Hz, 10 G peak, and a shock rating of 100 G, 11 ms.

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