SF-1206FP150-2 footprint, schematic symbol and 3D model by Bourns

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SF-1206FP150-2 Details

The recommended land pattern for the SF-1206FP150-2 is a rectangular pad with a size of 1.5 mm x 3.2 mm, with a non-solder mask defined (NSMD) pad shape.
To handle thermal considerations, ensure good thermal conduction by using a thermal pad on the PCB, and consider using a thermal interface material (TIM) between the component and the heat sink. Also, ensure good airflow around the component.
The maximum operating temperature range for the SF-1206FP150-2 is -40°C to +150°C, with a storage temperature range of -40°C to +150°C.
To ensure reliability in high-vibration environments, use a secure mounting method, such as a screw or adhesive, and consider using a vibration-dampening material between the component and the PCB.
The recommended soldering profile for the SF-1206FP150-2 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 217°C.

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