The recommended land pattern for the SF-1206SP100-2 is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
During reflow soldering, the SF-1206SP100-2 should be placed on a flat, even surface to prevent warping or deformation. The recommended reflow profile is a peak temperature of 260°C with a dwell time of 20-30 seconds.
The maximum operating temperature range for the SF-1206SP100-2 is -40°C to +125°C, with a storage temperature range of -40°C to +150°C.
Yes, the SF-1206SP100-2 is RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals) compliant, meeting the requirements for lead-free and halogen-free materials.
The recommended torque for the SF-1206SP100-2 is 0.5 N·m to 1.5 N·m, depending on the specific application and mounting requirements.
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SF-1206SP100-2 Overview
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