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SF-2410FPA400W-2 - Bourns

Description: Surface Mount Fuses 4 AMP 125V FAST ACTING

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PCB Footprints
SF-2410FPA400W-2 - Bourns PCB footprint - Fuses Chip - Fuses Chip - 6.1x2.49
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3D Models
SF-2410FPA400W-2 - Bourns  - 3D model - Fuses Chip - 6.1x2.49
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SF-2410FPA400W-2 Details

  • Manufacturer Part Number:

    SF-2410FPA400W-2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.10.00.40

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    8

  • Blow Characteristic:

    FAST

  • Body Breadth:

    2.49 mm

  • Body Height:

    2.16 mm

  • Body Length or Diameter:

    6.1 mm

  • Circuit Protection Type:

    ELECTRIC FUSE

  • Fuse Size:

    2410

  • Joule Integral-Nom:

    3 J

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Packing Method:

    TR, 7 INCH

  • Pre-arcing Time-Min:

    10 ms

  • Rated Breaking Capacity:

    50 A

  • Rated Current:

    4 A

  • Rated Voltage(DC):

    125 V

  • Reference Standard:

    AEC-Q200; UL

  • Surface Mount:

    YES

  • Terminal Shape:

    WRAPAROUND

SF-2410FPA400W-2 Frequently Asked Questions (FAQs)

  • Bourns recommends a symmetrical PCB layout with a solid ground plane, and keeping the input and output traces as short as possible to minimize inductance and radiation. A 4-layer PCB with a dedicated ground plane is recommended for high-frequency applications.
  • Follow the recommended soldering profile and use a solder with a melting point above 217°C. Ensure the component is properly aligned and seated on the PCB, and use a sufficient amount of solder to fill the pads. Avoid applying excessive force or pressure during soldering.
  • The SF-2410FPA400W-2 is rated for operation from -40°C to +125°C, but derating is required above 85°C. Consult the datasheet for specific derating curves and guidelines.
  • While the SF-2410FPA400W-2 is a high-quality component, it may not meet the specific requirements of high-reliability or aerospace applications. Consult Bourns' documentation and sales team to determine if a specific screening or qualification process is required for your application.
  • Consult the datasheet and application notes for troubleshooting guidelines. Common issues include incorrect PCB layout, inadequate heat sinking, or excessive input voltage. Use thermal imaging or other diagnostic tools to identify the root cause of the issue.

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SF-2410FPA400W-2 Overview

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