SF-2923UC60C-2 footprint, schematic symbol and 3D model by Bourns

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SF-2923UC60C-2 Details

Bourns provides a recommended PCB layout and land pattern in their application note AN164, which can be found on their website. It's essential to follow these guidelines to ensure proper mounting and thermal management of the component.
The SF-2923UC60C-2 has a high power rating, and proper thermal management is crucial. Ensure good airflow around the component, and consider using a heat sink or thermal pad to dissipate heat. The datasheet provides thermal resistance values to help with thermal design.
While the datasheet specifies an operating temperature range of -40°C to 150°C, it's essential to note that the component's performance and reliability may degrade at extreme temperatures. It's recommended to operate the component within a temperature range of -20°C to 125°C for optimal performance.
The SF-2923UC60C-2 is designed to withstand moderate vibration levels. However, if your application involves extreme vibration, it's recommended to consult with Bourns' technical support team to discuss specific requirements and potential customization options.
Bourns recommends following the IPC J-STD-020D.1 standard for soldering profiles. A peak temperature of 260°C and a dwell time of 30-45 seconds are recommended. It's essential to ensure that the soldering process does not exceed these parameters to prevent damage to the component.

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