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SF58G-AP - MCC

Description: Super Fast Recovery Rectifiers

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Symbol
SF58G-AP - MCC - PCB symbol
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PCB Footprints
SF58G-AP - MCC PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - DO-201AD
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3D Models
SF58G-AP - MCC - 3D model - Diodes, Axial Diameter Horizontal Mounting - DO-201AD
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for SF58G-AP
  • Part Number SF58G-AP
  • Manufacturer MCC
  • Pin Count 2
  • Part Category Schottky Diode
  • Package Category Diodes, Axial Diameter Horizontal Mounting
  • Footprint Name Diodes, Axial Diameter Horizontal Mounting - DO-201AD
  • Released Date Feb 5, 2024
  • Last Modified Date May 17, 2024 4:34 PM UTC
  • Pinout / Pin List Click Here (Member Only)

SF58G-AP Details

  • Manufacturer Part Number:

    SF58G-AP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-201AD

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-2

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6.07

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.75 V

  • JEDEC-95 Code:

    DO-201AD

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.035 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    10

SF58G-AP Frequently Asked Questions (FAQs)

  • The recommended PCB layout and land pattern for the SF58G-AP can be found in the Micro Commercial Components' application note AN-113, which provides detailed guidelines for optimal performance and thermal management.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow the derating guidelines provided in the datasheet, and to implement proper thermal management techniques such as heat sinking and airflow management.
  • The SF58G-AP has built-in ESD protection, but it is still recommended to follow standard ESD handling precautions such as using an ESD wrist strap, mat, or workstation, and to handle the device by the body rather than the leads.
  • Yes, the SF58G-AP is AEC-Q101 qualified, making it suitable for use in automotive applications. However, it is recommended to consult with Micro Commercial Components' application engineers to ensure the device meets the specific requirements of the application.
  • The SF58G-AP should be stored in a dry, cool place, away from direct sunlight and moisture. It is recommended to follow the storage and handling guidelines provided in the datasheet and to use anti-static packaging materials to prevent damage.

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SF58G-AP Overview

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