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SG2525AP013TR - STMicroelectronics

Description: Buck, Push-Pull Regulator Positive Output Step-Down, Step-Up/Step-Down - DC-DC Controller IC 16-SO

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SG2525AP013TR - STMicroelectronics PCB footprint - Small Outline Packages - Small Outline Packages - SO-16 Narrow_
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SG2525AP013TR Details

  • Manufacturer Part Number:

    SG2525AP013TR

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SO-16

  • Pin Count:

    16

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.9

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    35 V

  • Input Voltage-Min:

    8 V

  • Input Voltage-Nom:

    20 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e4

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Current-Max:

    0.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    20 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    PUSH-PULL

  • Switching Frequency-Max:

    500 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

SG2525AP013TR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would involve placing the SG2525AP013TR near a thermal pad or a heat sink, ensuring good airflow, and using thermal vias to dissipate heat efficiently.
  • To ensure reliable operation across the entire operating temperature range, it's essential to follow the recommended operating conditions, use a suitable thermal management system, and consider the device's thermal derating.
  • For EMI and EMC compliance, consider using a shielded enclosure, minimizing loop areas, using a common-mode choke, and following good PCB layout practices to reduce electromagnetic radiation.
  • To troubleshoot and debug issues, use a systematic approach, checking the power supply, input/output signals, and PCB layout. Utilize oscilloscopes, logic analyzers, and other diagnostic tools to identify the root cause of the issue.
  • Operating the SG2525AP013TR at the maximum junction temperature can reduce its lifespan and reliability. It's essential to ensure proper thermal management and consider derating the device to ensure reliable operation.

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SG2525AP013TR Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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