SG Micro Corp recommends a 2-layer or 4-layer PCB with a thermal pad connected to a large copper area on the bottom layer to dissipate heat efficiently. A minimum of 1 oz copper thickness is recommended.
SG Micro Corp recommends following the JEDEC J-STD-020D.1 standard for reflow soldering, with a peak temperature of 260°C and a dwell time of 30 seconds. Hand soldering is not recommended.
A 10uF to 22uF X7R or X5R ceramic capacitor is recommended, with a voltage rating of 10V or higher, placed as close as possible to the VIN pin.
Check the input voltage, output voltage, and enable pin voltage using an oscilloscope or multimeter. Verify the PCB layout and component values match the recommended design. Consult the datasheet and application notes for troubleshooting guidelines.
Yes, the SGM3001XC6/TR is lead-free and RoHS compliant, making it suitable for lead-free soldering processes.
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SGM3001XC6/TR Overview
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