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SGTL5000XNLA3 - NXP

Description: NXP - SGTL5000XNLA3 - CODEC, STEREO, HEADPHONE AMP, 20QFN

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PCB Footprints
SGTL5000XNLA3 - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN-20 2032-01
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3D Models
SGTL5000XNLA3 - NXP  - 3D model - Quad Flat No-Lead - QFN-20 2032-01
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SGTL5000XNLA3 Details

  • Manufacturer Part Number:

    SGTL5000XNLA3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    6.65

  • Additional Feature:

    ALSO OPERATE WITH 1.1V TO 2V DIGITAL SUPPLY

  • Analog Input-Max:

    2.83 V

  • Filter:

    YES

  • Input Type:

    SINGLE-ENDED

  • JESD-30 Code:

    S-XQCC-N20

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Linear Coding:

    NOT AVAILABLE

  • Moisture Sensitivity Level:

    3

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    VOLTAGE

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.12SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.6 mm

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    PCM CODEC

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

SGTL5000XNLA3 Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD first, followed by VDDA, and then the clock signal. This ensures proper initialization of the device.
  • To optimize ADC performance, ensure that the analog input signal is within the recommended range, use a low-pass filter to remove high-frequency noise, and adjust the ADC gain settings according to the input signal amplitude.
  • The DMI is used to connect digital microphones, such as pulse density modulation (PDM) microphones, to the SGTL5000. It allows for digital audio data transfer and clock synchronization between the microphone and the codec.
  • To configure the SGTL5000 for stereo audio playback, set the I2S format to 16-bit or 24-bit, and configure the DAC to output stereo audio. Additionally, ensure that the correct clock settings are used to synchronize the audio data transmission.
  • The SGTL5000 supports clock frequencies up to 50 MHz for the master clock and 12.288 MHz for the audio clock.

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SGTL5000XNLA3 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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