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SH8K32TB1 - ROHM Semiconductor

Description: 4V Drive Nch+Nch MOSFET

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SH8K32TB1 - ROHM Semiconductor - PCB symbol
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PCB Footprints
SH8K32TB1 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - 8 lead sop
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3D Models
SH8K32TB1 - ROHM Semiconductor - 3D model - Small Outline Packages - 8 lead sop
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SH8K32TB1 Details

  • Manufacturer Part Number:

    SH8K32TB1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    4.5 A

  • Drain-source On Resistance-Max:

    0.077 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    55 pF

  • JESD-30 Code:

    R-PDSO-G8

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2 W

  • Pulsed Drain Current-Max (IDM):

    18 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SH8K32TB1 Frequently Asked Questions (FAQs)

  • ROHM recommends a 4-layer PCB with a thermal relief pattern on the bottom layer to improve heat dissipation. A minimum of 2 oz copper thickness is recommended for the thermal pad.
  • Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K, and follow the recommended PCB layout guidelines. Additionally, consider using a heat sink with a thermal resistance of less than 10°C/W.
  • The maximum allowed voltage on the input pins is 5.5V, but it's recommended to keep it below 5V to ensure reliable operation and prevent damage to the device.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input lines, and ensure that the PCB design follows ESD protection guidelines. Additionally, handle the device by the body or use an anti-static wrist strap to prevent ESD damage during handling.
  • Power up the device in the following sequence: VCC, AVCC, and then the input signals. Ensure that the power supply voltage is stable and within the recommended range before applying input signals.

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SH8K32TB1 Overview

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