A thermal pad is recommended under the IC, and a 2-layer or 4-layer PCB with a solid ground plane is suggested to reduce thermal resistance. A minimum of 2 oz copper thickness is recommended for the thermal pad.
The device requires a soft-start power-on sequence to prevent inrush currents. A recommended power-on sequence is: VCC, then EN, then VIN. For power-off, the sequence should be reversed.
The maximum allowed voltage on the EN pin is VCC + 0.3V. Exceeding this voltage may damage the device.
The device requires a specific power sequencing to prevent damage. The recommended sequence is: VCC, then EN, then VIN. A power sequencing circuit or a dedicated power management IC can be used to ensure proper sequencing.
The recommended operating frequency range for the SH8K37GZETB is 100 kHz to 2 MHz. Operating outside this range may affect device performance and stability.
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SH8K37GZETB Overview
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