- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SI2347DS-T1-BE3
- Part Number SI2347DS-T1-BE3
- Manufacturer Vishay
- Pin Count 3
- Part Category Integrated Circuit
- Package Category SOT23 (3-Pin)
- Footprint Name SOT23 (3-Pin) - sot-23-ren5
- Released Date Mar 27, 2022
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
SI2347DS-T1-BE3 Details
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Manufacturer Part Number:
SI2347DS-T1-BE3
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
TO-236, SOT-23, 3 PIN
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ECCN Code:
EAR99
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Factory Lead Time:
15 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
5
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Configuration:
SINGLE WITH BUILT-IN DIODE
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DS Breakdown Voltage-Min:
30 V
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Drain Current-Max (ID):
5 A
SI2347DS-T1-BE3 Frequently Asked Questions (FAQs)
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The recommended PCB footprint is a standard SOT23-3L package with a 1.3mm x 1.3mm body size and 0.5mm lead pitch. A sample footprint can be found in the Vishay Intertechnologies' application note AN81142.
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To ensure optimal thermal performance, ensure a good thermal connection between the MOSFET's drain tab and a heat sink or a thermal pad on the PCB. Use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K. Keep the MOSFET away from heat sources and ensure good airflow around the device.
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The maximum allowed power dissipation (PD) is dependent on the ambient temperature (TA) and the thermal resistance (RθJA). For the SI2347DS-T1-BE3, the maximum PD is approximately 1.4W at TA = 25°C and RθJA = 125°C/W. Use the datasheet's thermal derating curve to determine the maximum PD for your specific application.
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Yes, the SI2347DS-T1-BE3 is suitable for high-frequency switching applications up to 1 MHz. However, ensure that the gate drive circuitry is properly designed to minimize ringing and overshoot, and that the MOSFET's switching losses are considered in your thermal design.
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Handle the MOSFET by the body, not the leads, to prevent ESD damage. Use an ESD wrist strap or mat, and ensure that the workspace and tools are ESD-protected. Store the devices in their original packaging or in an ESD-protected container.
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SI2347DS-T1-BE3 Overview
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