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SI32179-B-FM1 - Skyworks

Description: PROSLIC® SINGLE-CHIP FXS SOLUTION WITH FXO OPTION

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Symbol
SI32179-B-FM1 - Skyworks - PCB symbol
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PCB Footprints
SI32179-B-FM1 - Skyworks PCB footprint - Other - Other - SI32179-B-FM1-2
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3D Models
SI32179-B-FM1 - Skyworks - 3D model - Other - SI32179-B-FM1-2
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SI32179-B-FM1 Details

  • Manufacturer Part Number:

    SI32179-B-FM1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LGA-42

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Skyworks Solutions Inc

  • Battery Feed:

    CONSTANT CURRENT/RESISTIVE

  • Battery Supply:

    -15 TO -136 V

  • Hybrid:

    2-4 CONVERSION

  • JESD-30 Code:

    R-XLGA-N42

  • Length:

    7 mm

  • Noise-Max:

    12 dBrnC

  • Number of Functions:

    1

  • Number of Terminals:

    42

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HLGA

  • Package Equivalence Code:

    LCC42,.27X.2,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, HEAT SINK/SLUG

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    SLIC

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    5 mm

SI32179-B-FM1 Frequently Asked Questions (FAQs)

  • Skyworks provides a recommended PCB layout and land pattern in their application note AN40467, which can be found on their website. It's essential to follow these guidelines to ensure optimal performance and minimize parasitic effects.
  • Skyworks offers a free online tool, the Skyworks Matching Network Designer, which can help optimize the input and output matching networks for the SI32179-B-FM1. Additionally, the application note AN40467 provides guidance on matching network design.
  • While the datasheet specifies an operating temperature range of -40°C to +85°C, Skyworks recommends derating the device's power output above +70°C to ensure reliable operation and prevent overheating.
  • Skyworks provides guidance on EMC and EMI reduction in their application note AN40467. Additionally, following proper PCB layout and shielding practices, using filtering components, and implementing good design practices can help minimize EMI and ensure EMC.
  • Skyworks recommends following the JEDEC J-STD-020D.1 standard for soldering and assembly. Additionally, they provide specific guidance on reflow soldering and manual soldering in their application note AN40467.

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SI32179-B-FM1 Overview

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