- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SI3456DDV-T1-E3
- Part Number SI3456DDV-T1-E3
- Manufacturer Vishay
- Pin Count 6
- Part Category Integrated Circuit
- Package Category Small Outline Packages
- Footprint Name Small Outline Packages - TSOP-6
- Released Date Jan 30, 2024
- Last Modified Date Jan 30, 2024 6:25 AM UTC
- Pinout / Pin List Click Here (Member Only)
SI3456DDV-T1-E3 Details
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Manufacturer Part Number:
SI3456DDV-T1-E3
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
MO-193C, TSOP-6
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ECCN Code:
EAR99
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Factory Lead Time:
15 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
5
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Configuration:
SINGLE WITH BUILT-IN DIODE
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DS Breakdown Voltage-Min:
30 V
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Drain Current-Max (ID):
6.3 A
SI3456DDV-T1-E3 Frequently Asked Questions (FAQs)
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The recommended land pattern for the SI3456DDV-T1-E3 can be found in the Vishay Intertechnologies' application note AN81193, which provides guidelines for PCB layout and assembly.
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The SI3456DDV-T1-E3 has a thermal pad that should be connected to a thermal plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, ensure good airflow around the device and consider using a heat sink if necessary.
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The SI3456DDV-T1-E3 has an operating temperature range of -55°C to 150°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range. It's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance.
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The SI3456DDV-T1-E3 is a commercial-grade device, but Vishay Intertechnologies offers a high-reliability version, the SI3456DDV-T1-E3HL, which is designed for high-reliability and aerospace applications. Contact Vishay Intertechnologies for more information on the high-reliability version.
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Follow the recommended soldering profile and guidelines provided in the Vishay Intertechnologies' application note AN81193. Ensure the PCB is designed with a solder mask and a solder land pattern that matches the device's footprint. Use a solder with a melting point compatible with the device's temperature rating.
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SI3456DDV-T1-E3 Overview
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