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SI4425BDY-T1-GE3 - Vishay

Description: MOSFET 30V 11.4A 2.5W 12mohm @ 10V

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SI4425BDY-T1-GE3 - Vishay PCB footprint - Small Outline Packages - Small Outline Packages - SOIC (NARROW) 8-LEAD
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SI4425BDY-T1-GE3 Details

  • Manufacturer Part Number:

    SI4425BDY-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    8.8 A

  • Drain-source On Resistance-Max:

    0.012 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.5 W

  • Pulsed Drain Current-Max (IDM):

    50 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Pure Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    230 ns

  • Turn-on Time-Max (ton):

    45 ns

SI4425BDY-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI4425BDY-T1-GE3 is a 5-pin SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a thermal pad size of 2.5 mm x 2.5 mm.
  • To ensure proper soldering, use a soldering iron with a temperature of 260°C to 280°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the device.
  • The maximum operating temperature range for the SI4425BDY-T1-GE3 is -55°C to 150°C, but it's recommended to operate within -40°C to 125°C for optimal performance and reliability.
  • To prevent ESD damage, handle the SI4425BDY-T1-GE3 with an ESD wrist strap or mat, and ensure the PCB is designed with ESD protection in mind, such as using ESD diodes or resistors.
  • Store the SI4425BDY-T1-GE3 in a dry, cool place with a temperature range of 5°C to 30°C and relative humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.

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SI4425BDY-T1-GE3 Overview

Use the download button to access the SI4425BDY-T1-GE3 schematic symbol, PCB footprint, and 3D model.
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For a full list of alternate parts for SI4425BDY-T1-GE3, check out Findchips.com