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SI4434ADY-T1-GE3 - Vishay

Description: MOSFET 250V Vds 20V Vgs SO-8

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SI4434ADY-T1-GE3 - Vishay PCB footprint - Small Outline Packages - Small Outline Packages - SOIC (NARROW): 8-LEAD JEDEC Part Number: MS-012
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SI4434ADY-T1-GE3 - Vishay  - 3D model - Small Outline Packages - SOIC (NARROW): 8-LEAD JEDEC Part Number: MS-012
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SI4434ADY-T1-GE3 Details

  • Manufacturer Part Number:

    SI4434ADY-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC, SOP-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    29 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    7.2 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    250 V

  • Drain Current-Max (ID):

    4.1 A

  • Drain-source On Resistance-Max:

    0.15 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    2 pF

  • JEDEC-95 Code:

    MS-012AA

  • JESD-30 Code:

    R-PDSO-G8

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    6 W

  • Pulsed Drain Current-Max (IDM):

    25 A

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    80 ns

  • Turn-on Time-Max (ton):

    60 ns

SI4434ADY-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB layout and land pattern for the SI4434ADY-T1-GE3 can be found in the Vishay Intertechnologies application note AN10343. It provides guidelines for optimal PCB design, including pad sizes, spacing, and thermal considerations.
  • To ensure reliable operation across the full temperature range, it's essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and consider thermal management techniques such as heat sinks or thermal vias. Additionally, ensure that the device is operated within its specified voltage and current ratings.
  • The SI4434ADY-T1-GE3 has built-in ESD protection, but it's still important to follow standard ESD handling precautions during assembly and testing. This includes using ESD-safe workstations, wrist straps, and packaging materials, as well as minimizing handling and exposure to static-prone environments.
  • Yes, the SI4434ADY-T1-GE3 is suitable for high-reliability and aerospace applications. Vishay Intertechnologies offers a range of screening and qualification options for these applications, including burn-in, temperature cycling, and radiation testing. Contact Vishay Intertechnologies for more information on their high-reliability and aerospace product offerings.
  • The recommended soldering and rework conditions for the SI4434ADY-T1-GE3 can be found in the Vishay Intertechnologies application note AN10343. It provides guidelines for soldering temperatures, times, and techniques, as well as rework procedures to minimize thermal stress and ensure reliable operation.

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SI4434ADY-T1-GE3 Overview

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