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Si4459BDY-T1-GE3 - Vishay

Description: VISHAY - SI4459BDY-T1-GE3 - MOSFET, P-CH, -30V, -27.8A, SOIC

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Si4459BDY-T1-GE3 - Vishay PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8-ren4
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Si4459BDY-T1-GE3 - Vishay  - 3D model - Small Outline Packages - SOIC-8-ren4
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Si4459BDY-T1-GE3 Details

  • Manufacturer Part Number:

    SI4459BDY-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MS-012, SOIC-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7

  • Avalanche Energy Rating (Eas):

    31.2 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    27.8 A

  • Drain-source On Resistance-Max:

    0.0049 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    70 pF

  • JEDEC-95 Code:

    MS-012AA

  • JESD-30 Code:

    R-PDSO-G8

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    5.6 W

  • Pulsed Drain Current-Max (IDM):

    150 A

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    106 ns

  • Turn-on Time-Max (ton):

    240 ns

Si4459BDY-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI4459BDY-T1-GE3 is a 5-pin SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a thermal pad size of 2.5 mm x 2.5 mm.
  • To ensure proper soldering, use a soldering iron with a temperature of 260°C to 280°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes thermal stress on the component.
  • The maximum operating temperature range for the SI4459BDY-T1-GE3 is -40°C to 150°C, with a storage temperature range of -40°C to 150°C.
  • To handle ESD protection, use an ESD wrist strap or mat, and ensure the PCB is designed with ESD protection in mind, including the use of ESD-sensitive component handling and storage procedures.
  • The recommended input capacitance for the SI4459BDY-T1-GE3 is 10 nF to 100 nF, depending on the specific application and noise filtering requirements.

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Si4459BDY-T1-GE3 Overview

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