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SI5419DU-T1-GE3 - Vishay

Description: Vishay SI5419DU-T1-GE3 P-channel MOSFET Transistor, 9.9 A, -30 V, 8-Pin PowerPAK ChipFET

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SI5419DU-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK® ChipFET
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SI5419DU-T1-GE3 - Vishay  - 3D model - Other - PowerPAK® ChipFET
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SI5419DU-T1-GE3 Details

  • Manufacturer Part Number:

    SI5419DU-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, LEADLESS, THIN, POWERPAK, CHIPFET-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.4

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    12 A

  • Drain-source On Resistance-Max:

    0.02 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-N3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    31 W

  • Pulsed Drain Current-Max (IDM):

    40 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI5419DU-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI5419DU-T1-GE3 is a standard QFN-16 package with a 3x3mm body size and 0.5mm pitch. A recommended land pattern is available in the Vishay Intertechnologies application note or can be obtained from the manufacturer's website.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the datasheet. Additionally, use a solder paste with a melting point compatible with the device's temperature rating, and ensure the PCB is designed with adequate thermal relief and solder mask clearance.
  • The SI5419DU-T1-GE3 has a maximum junction temperature of 150°C. To ensure reliable operation, provide adequate heat dissipation through the use of thermal vias, heat sinks, or thermal interface materials. Follow the thermal management guidelines in the datasheet and application notes to ensure the device operates within its specified temperature range.
  • The SI5419DU-T1-GE3 is a commercial-grade device, but Vishay Intertechnologies offers automotive-grade and high-reliability versions of the device with enhanced quality and reliability features. Contact Vishay Intertechnologies for more information on these specialized products.
  • To troubleshoot issues, start by reviewing the datasheet and application notes to ensure proper device operation and PCB design. Use oscilloscopes and logic analyzers to debug signal integrity and timing issues. If issues persist, contact Vishay Intertechnologies' technical support for further assistance.

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SI5419DU-T1-GE3 Overview

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