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SI7661CSA+ - Analog Devices

Description: SI7661CSA+, Charge Pump Inverting, -20 → -4.5 V, 8-Pin, SOIC

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SI7661CSA+ - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - soic8-ren3
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SI7661CSA+ Details

  • Manufacturer Part Number:

    SI7661CSA+

  • Brand Name:

    Analog Devices Inc

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    8-SOIC_N-150_MIL

  • Package Description:

    SO-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    8-SOIC_N-150_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    1999-06-04

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SWITCHED CAPACITOR CONVERTER

  • Input Voltage-Max:

    20 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Output Current-Max:

    0.02 A

  • Output Voltage-Nom:

    -20 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    2 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    DOUBLER INVERTER

  • Switching Frequency-Max:

    10 kHz

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

SI7661CSA+ Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the SI7661CSA+ is to keep the input and output capacitors close to the device, and to use a solid ground plane to minimize noise and EMI. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
  • To ensure stability, make sure to follow the recommended component values and PCB layout guidelines. Also, ensure that the input voltage is within the recommended range, and that the output capacitor is of sufficient value and type (e.g. X5R or X7R ceramic). Additionally, avoid using long traces and minimize the loop area of the feedback network.
  • The maximum output current of the SI7661CSA+ is 1A, but it is recommended to derate the output current based on the ambient temperature and the input voltage. Refer to the datasheet for the derating curves.
  • The SI7661CSA+ is rated for operation up to 125°C, but the device's performance and reliability may degrade at high temperatures. It is recommended to derate the output current and to ensure good thermal management (e.g. using a heat sink) to prevent overheating.
  • To troubleshoot issues with the SI7661CSA+, start by checking the input voltage, output voltage, and output current. Use an oscilloscope to check for oscillations or noise on the output. Also, check the PCB layout and component values to ensure they meet the recommended specifications. If the issue persists, consult the datasheet and application notes for further guidance.

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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