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SI8233BB-D-IS - Skyworks

Description: Isolated Gate Drivers 2.5 kV 8 V UVLO HS/LS isolated gate driver

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PCB Footprints
SI8233BB-D-IS - Skyworks PCB footprint - Small Outline Packages - Small Outline Packages - 16-Pin Wide Body SOIC
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3D Models
SI8233BB-D-IS - Skyworks  - 3D model - Small Outline Packages - 16-Pin Wide Body SOIC
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SI8233BB-D-IS Details

  • Manufacturer Part Number:

    SI8233BB-D-IS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-16

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Skyworks Solutions Inc

  • YTEOL:

    8.4

  • Built-in Protections:

    UNDER VOLTAGE

  • High Side Driver:

    YES

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    10.3 mm

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Peak Current Limit-Nom:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    24 V

  • Supply Voltage1-Min:

    6.5 V

  • Supply Voltage1-Nom:

    12 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.045 µs

  • Turn-on Time:

    0.045 µs

  • Width:

    7.5 mm

SI8233BB-D-IS Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves keeping the device away from high-current carrying traces, using a solid ground plane, and placing thermal vias under the device. Thermal management involves using a heat sink or thermal pad to keep the junction temperature below 125°C.
  • To ensure EMC, use a shielded enclosure, keep the device away from antennas and high-frequency circuits, and use filtering and shielding on the input and output lines. Additionally, follow the recommended PCB layout and grounding practices.
  • The maximum allowable voltage on the input pins is 5.5V, exceeding which may cause permanent damage to the device.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the input and output lines, and follow proper handling and storage procedures to prevent ESD damage.
  • The recommended operating frequency range for the SI8233BB-D-IS is 100 kHz to 500 kHz, although the device can operate up to 1 MHz with reduced performance.

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SI8233BB-D-IS Overview

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