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SI8261BBC-C-ISR - Skyworks

Description:  Pin-compatible, drop-in upgrades for popular high speed opto-coupled gate drivers  Low power diode emulator simplifies design-in process  0.6 and 4.0 Amp peak output drive current  Rail-to-rail output voltage  Performance and reliability advantages vs. opto-drivers Resistant to temperature and age 10x lower FIT rate for longer service life 14x tighter part-to-part matching Higher common-mode transient immunity: >50 kV/µs typical  Robust protection features Multiple UVLO ord

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PCB Footprints
SI8261BBC-C-ISR - Skyworks PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin Narrow Body SOIC
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3D Models
SI8261BBC-C-ISR - Skyworks  - 3D model - Small Outline Packages - 8-Pin Narrow Body SOIC
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SI8261BBC-C-ISR Details

  • Manufacturer Part Number:

    SI8261BBC-C-ISR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active Unconfirmed

  • Package Description:

    SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Skyworks Solutions Inc

  • YTEOL:

    6

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    30 V

  • Supply Voltage-Min:

    6.5 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.05 µs

  • Turn-on Time:

    0.06 µs

  • Width:

    3.9 mm

SI8261BBC-C-ISR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a common mode choke or a ferrite bead to filter the power supply.
  • Ensure good thermal conductivity by using a heat sink or a thermal pad. Keep the device away from heat sources and ensure good airflow. Derate the current handling capability according to the temperature derating curve in the datasheet.
  • The maximum allowable voltage on the enable pin (EN) is VCC + 0.3V. Exceeding this voltage may damage the device.
  • Yes, the SI8261BBC-C-ISR is suitable for hot-swap applications. However, ensure that the device is powered down before hot-swapping to prevent damage.
  • Use an oscilloscope to check the input and output waveforms. Verify the power supply voltage and current. Check for proper PCB layout and thermal management. Consult the datasheet and application notes for troubleshooting guidelines.

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SI8261BBC-C-ISR Overview

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Buffer or Inverter Based IGBT/MOSFET Driver, PDSO8