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SI8271AB-ISR - Skyworks

Description: Gate Drivers 4A, 2.5 KV Single Channel High CMTI Driver

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SI8271AB-ISR - Skyworks - PCB symbol
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PCB Footprints
SI8271AB-ISR - Skyworks PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin Narrow Body SOIC
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3D Models
SI8271AB-ISR - Skyworks - 3D model - Small Outline Packages - 8-Pin Narrow Body SOIC
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SI8271AB-ISR Details

  • Manufacturer Part Number:

    SI8271AB-ISR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Skyworks Solutions Inc

  • YTEOL:

    8.1

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    10 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    30 V

  • Supply Voltage1-Min:

    4.2 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.075 µs

  • Turn-on Time:

    0.075 µs

  • Width:

    3.9 mm

SI8271AB-ISR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for heat dissipation. Use a thermal pad on the bottom of the device and connect it to a thermal plane on the PCB.
  • Use a Smith chart or a network analyzer to optimize the input and output matching networks. The device's input and output impedances are 50 ohms, so a conjugate match is recommended. Use a pi-network or a T-network topology for the matching circuits.
  • The recommended operating voltage is 3.3V, and the maximum current is 150mA. However, the device can operate from 2.7V to 5.5V, but the performance may vary. Ensure the power supply is decoupled with a 10uF capacitor.
  • Use a shielded enclosure and ensure the PCB is designed with EMC in mind. Use a common-mode choke and a ferrite bead on the power supply lines. Ensure the device is placed at least 1mm away from the PCB edge to reduce radiation.
  • Use a network analyzer to measure the device's S-parameters. Perform a 1-port calibration before measuring the device's reflection coefficient. Use a signal generator and a spectrum analyzer to measure the device's output power and spectral purity.

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SI8271AB-ISR Overview

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