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SI8271DB-ISR - Skyworks

Description: Gate Drivers 4A, 2.5 KV Single Channel High CMTI Driver

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Symbol
SI8271DB-ISR - Skyworks - PCB symbol
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PCB Footprints
SI8271DB-ISR - Skyworks PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin Narrow Body SOIC
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3D Models
SI8271DB-ISR - Skyworks - 3D model - Small Outline Packages - 8-Pin Narrow Body SOIC
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SI8271DB-ISR Details

  • Manufacturer Part Number:

    SI8271DB-ISR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Skyworks Solutions Inc

  • YTEOL:

    8.1

  • High Side Driver:

    NO

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    10 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    30 V

  • Supply Voltage1-Min:

    4.2 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.06 µs

  • Turn-on Time:

    0.06 µs

  • Width:

    3.9 mm

SI8271DB-ISR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Ensure proper thermal management by providing adequate heat sinking and airflow. Follow the recommended operating temperature range and derate the device's power handling accordingly.
  • Ensure a stable and regulated power supply with minimal ripple and noise. Use a high-quality decoupling capacitor and consider adding a ferrite bead or inductor to filter out high-frequency noise.
  • Use a logic analyzer or oscilloscope to monitor the device's control signals and output waveforms. Check for proper power supply, decoupling, and signal integrity. Consult the datasheet and application notes for troubleshooting guidelines.
  • Follow proper PCB layout and shielding techniques to minimize EMI radiation. Ensure proper filtering and decoupling of the power supply and signal lines. Consult the datasheet and relevant industry standards for EMI and EMC compliance guidelines.

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SI8271DB-ISR Overview

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