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SI8271GB-ISR - Skyworks

Description: Gate Drivers 4A, 2.5 KV Single Channel High CMTI Driver

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Symbol
SI8271GB-ISR - Skyworks - PCB symbol
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PCB Footprints
SI8271GB-ISR - Skyworks PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin Narrow Body SOIC_2022
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3D Models
SI8271GB-ISR - Skyworks - 3D model - Small Outline Packages - 8-Pin Narrow Body SOIC_2022
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SI8271GB-ISR Details

  • Manufacturer Part Number:

    SI8271GB-ISR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Skyworks Solutions Inc

  • YTEOL:

    8.1

  • High Side Driver:

    NO

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    4 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    10 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    30 V

  • Supply Voltage1-Min:

    4.2 V

  • Supply Voltage1-Nom:

    15 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    0.06 µs

  • Turn-on Time:

    0.06 µs

  • Width:

    3.9 mm

SI8271GB-ISR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from the power plane to minimize noise and EMI.
  • Ensure proper thermal management by providing adequate heat sinking and airflow. Use a thermal interface material (TIM) between the device and the heat sink, and follow the recommended operating temperature range.
  • Ensure a stable and regulated power supply with minimal ripple and noise. Use a low-ESR capacitor and a ferrite bead or inductor to filter the power supply lines.
  • Use a logic analyzer or oscilloscope to monitor the device's input and output signals. Check the power supply voltage, clock signal, and data lines for any anomalies or noise.
  • Use a shielded enclosure, keep the device away from antennas and other EMI sources, and use EMI filters or ferrite beads on the I/O lines. Ensure proper grounding and shielding of the PCB and cables.

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SI8271GB-ISR Overview

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