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SI8606AC-B-IS1 - Skyworks

Description: Digital Isolators 3.75 kV uni- and bi-directional isolator

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SI8606AC-B-IS1 - Skyworks - PCB symbol
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SI8606AC-B-IS1 - Skyworks PCB footprint - Small Outline Packages - Small Outline Packages - 16-Pin Narrow Body SOIC
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SI8606AC-B-IS1 - Skyworks - 3D model - Small Outline Packages - 16-Pin Narrow Body SOIC
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SI8606AC-B-IS1 Details

  • Manufacturer Part Number:

    SI8606AC-B-IS1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Skyworks Solutions Inc

  • Additional Feature:

    ALSO OPERARTES AT 5V SUPPLY

  • Interface IC Type:

    DIGITAL ISOLATOR

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    9.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

SI8606AC-B-IS1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the signal traces short and away from noise sources. Use a common mode choke or ferrite bead to filter the power supply.
  • Ensure good thermal design and heat sinking. Use a thermal pad or heat sink to dissipate heat. Keep the device away from heat sources and ensure good airflow. Consider using a thermal interface material to improve heat transfer.
  • A 10uF to 22uF ceramic capacitor is recommended for input decoupling. Place the capacitor close to the device and use a low-ESR capacitor to minimize voltage ripple.
  • Use an oscilloscope to check the input and output waveforms. Verify the input voltage and current. Check for proper PCB layout and decoupling. Consult the datasheet and application notes for troubleshooting guides.
  • Yes, but ensure that the device is used within its specified operating conditions and that the system is designed with redundancy and fault tolerance. Consult the datasheet and relevant industry standards for guidance.

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SI8606AC-B-IS1 Overview

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