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SI8710CC-B-ISR - Skyworks

Description: Digital Isolators 3.75 kV optocoupler replacement in SOIC8

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SI8710CC-B-ISR - Skyworks - PCB symbol
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PCB Footprints
SI8710CC-B-ISR - Skyworks PCB footprint - Small Outline Packages - Small Outline Packages - SI8620BC-B-IS
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3D Models
SI8710CC-B-ISR - Skyworks - 3D model - Small Outline Packages - SI8620BC-B-IS
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SI8710CC-B-ISR Details

  • Manufacturer Part Number:

    SI8710CC-B-ISR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Skyworks Solutions Inc

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G8

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

SI8710CC-B-ISR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the center of the board, and the input and output tracks should be kept short and away from noise sources.
  • The device requires a single 3.3V power supply, and the recommended biasing is to connect the VCC pin to a 3.3V power source through a 10uF capacitor. The VEE pin should be connected to ground through a 10uF capacitor.
  • The SI8710CC-B-ISR is designed to operate up to 1.4 GHz, but the maximum operating frequency may vary depending on the specific application and PCB layout.
  • The device has a thermal pad on the bottom of the package, which should be connected to a thermal ground plane on the PCB. A thermal interface material (TIM) can be used to improve heat transfer between the device and the PCB.
  • The device has a nominal input impedance of 50 ohms and a nominal output impedance of 50 ohms. The recommended impedance matching is to use a pi-network or a T-network with a 50-ohm load.

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SI8710CC-B-ISR Overview

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