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SI8752AB-IS - Skyworks

Description: DGTL ISO 2.5KV GATE DRIVER 8SOIC

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SI8752AB-IS - Skyworks PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin Narrow Body SOIC
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SI8752AB-IS - Skyworks  - 3D model - Small Outline Packages - 8-Pin Narrow Body SOIC
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SI8752AB-IS Details

  • Manufacturer Part Number:

    SI8752AB-IS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Skyworks Solutions Inc

  • YTEOL:

    6

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2A

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    9.5 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.25 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    35 µs

  • Turn-on Time:

    720 µs

  • Width:

    3.9 mm

SI8752AB-IS Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the SI8752AB-IS involves keeping the input and output traces as short as possible, using a solid ground plane, and placing the device close to the isolation barrier. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to minimize noise and EMI.
  • To ensure reliable operation of the SI8752AB-IS in high-temperature environments, it's essential to follow proper thermal management practices. This includes providing adequate heat sinking, using a thermally conductive PCB material, and ensuring good airflow around the device. Additionally, the device should be operated within its specified temperature range, and the junction temperature should be monitored to prevent overheating.
  • The SI8752AB-IS has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding personnel and equipment, and using ESD-protective packaging. Additionally, the device should be powered up and down slowly to prevent voltage spikes that can damage the device.
  • To troubleshoot issues with the SI8752AB-IS, start by verifying that the device is properly powered and configured. Check the input and output signals using an oscilloscope or logic analyzer to ensure they are within the specified ranges. Also, check for any signs of physical damage, such as overheating or mechanical stress. If the issue persists, consult the datasheet and application notes, and contact Skyworks Solutions Inc. technical support for further assistance.
  • When working with the SI8752AB-IS, it's essential to follow proper safety precautions to avoid electrical shock, injury, or damage to the device. This includes using protective equipment such as safety glasses and gloves, ensuring the device is properly grounded, and avoiding exposure to high voltages or currents. Additionally, the device should be handled and stored in a clean, dry environment to prevent damage or contamination.

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