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SI9986DY-T1-E3 - Vishay

Description: Buffered H-Bridge

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SI9986DY-T1-E3 - Vishay - PCB symbol
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PCB Footprints
SI9986DY-T1-E3 - Vishay PCB footprint - Other - Other - SOIC127P600X175-8N
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SI9986DY-T1-E3 - Vishay - 3D model - Other - SOIC127P600X175-8N
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SI9986DY-T1-E3 Details

  • Manufacturer Part Number:

    SI9986DY-T1-E3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Built-in Protections:

    TRANSIENT

  • Driver Number of Bits:

    2

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    HALF BRIDGE BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Current-Max:

    1 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.3 mA

  • Supply Voltage-Max:

    13.2 V

  • Supply Voltage-Min:

    3.8 V

  • Supply Voltage-Nom:

    4.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

SI9986DY-T1-E3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI9986DY-T1-E3 is a 5-pin SOT23 package with a minimum pad size of 1.3 mm x 1.3 mm and a thermal pad size of 2.5 mm x 2.5 mm.
  • To ensure the SI9986DY-T1-E3 operates within its SOA, ensure the maximum voltage rating is not exceeded, and the device is not exposed to excessive temperatures, currents, or power dissipation. Refer to the datasheet for specific SOA guidelines.
  • A combination of thermal vias, thermal pads, and a heat sink can be used to effectively manage the thermal performance of the SI9986DY-T1-E3. Ensure the thermal interface material (TIM) has a thermal conductivity of at least 1 W/m-K.
  • Yes, the SI9986DY-T1-E3 is qualified for automotive and high-reliability applications. However, it's essential to consult with Vishay Intertechnologies' application engineers to ensure the device meets the specific requirements of your application.
  • To troubleshoot issues with the SI9986DY-T1-E3, start by verifying the device is properly soldered and the PCB layout is correct. Check for excessive heat, voltage, or current stress. Consult the datasheet and application notes for troubleshooting guidelines.

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SI9986DY-T1-E3 Overview

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