The recommended PCB footprint for the SIC472ED-T1-GE3 is a thermal pad with a minimum size of 2.5 mm x 2.5 mm, with a 1 oz copper thickness and a solder mask opening of 2.2 mm x 2.2 mm.
To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. Apply a small amount of solder paste to the thermal pad, and use a reflow oven with a peak temperature of 250°C for 10-15 seconds.
The maximum operating temperature range for the SIC472ED-T1-GE3 is -55°C to 175°C, with a maximum junction temperature of 175°C.
To handle ESD protection, use a wrist strap or mat with a resistance of 1 MΩ to 10 MΩ, and ensure that the device is stored in an ESD-protected environment. During handling, avoid touching the device's pins or thermal pad.
Store the SIC472ED-T1-GE3 in a dry, cool place with a relative humidity of 50% or less, and a temperature range of 20°C to 30°C. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
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SIC472ED-T1-GE3 Overview
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