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SID1102K-TL - Power Integrations

Description: MOSFET iDriver, 1200V Scale, 4.75V to 5.25V Supply, 5A Out, 262ns Delay, eSOP-16

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SID1102K-TL - Power Integrations PCB footprint - Other - Other - eSOP-R16B_2023
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SID1102K-TL Details

  • Manufacturer Part Number:

    SID1102K-TL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2017-11-28

  • Manufacturer:

    Power Integrations

  • YTEOL:

    8

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G15

  • Length:

    10.16 mm

  • Number of Functions:

    1

  • Number of Terminals:

    15

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP15/16,.46

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Seated Height-Max:

    2.67 mm

  • Supply Current-Max:

    23 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    28 V

  • Supply Voltage1-Min:

    22 V

  • Supply Voltage1-Nom:

    25 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Turn-off Time:

    359 µs

  • Turn-on Time:

    364 µs

  • Width:

    8.89 mm

SID1102K-TL Frequently Asked Questions (FAQs)

  • Power Integrations provides a recommended PCB layout guide in their application notes (AN-63) which includes guidelines for component placement, thermal management, and routing to minimize EMI and ensure reliable operation.
  • Proper thermal management involves providing a heat sink or thermal pad, ensuring good airflow, and keeping the device away from heat sources. The datasheet provides thermal resistance values (RθJA and RθJC) to help with thermal design. Additionally, Power Integrations provides thermal management guidelines in their application notes (AN-63).
  • Using a different transformer may affect the performance, efficiency, and reliability of the SID1102K-TL. The recommended transformer is designed to optimize the device's performance, and using a different one may require additional design considerations, such as adjusting the turns ratio, magnetizing inductance, and leakage inductance.
  • Power Integrations provides a troubleshooting guide in their application notes (AN-63) which covers common issues and their possible causes. Additionally, engineers can use oscilloscopes and other diagnostic tools to analyze the device's behavior and identify the root cause of the issue.
  • Yes, the SID1102K-TL requires proper EMI filtering to meet regulatory requirements and ensure reliable operation. Power Integrations provides EMI filtering guidelines in their application notes (AN-63), including recommendations for filter components and layout.

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SID1102K-TL Overview

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