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SID1132K-TL - Power Integrations

Description: Gate Drivers Sgl Ch 2.5A Fluxlink 250kHz Delay 260ns

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SID1132K-TL - Power Integrations PCB footprint - Other - Other - eSOP-R16B Package
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SID1132K-TL Details

  • Manufacturer Part Number:

    SID1132K-TL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Power Integrations

  • YTEOL:

    8.1

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G15

  • Length:

    10.16 mm

  • Number of Functions:

    1

  • Number of Terminals:

    15

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Peak Current Limit-Nom:

    2.5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP15/16,.46

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.67 mm

  • Supply Current-Max:

    23 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    28 V

  • Supply Voltage1-Min:

    22 V

  • Supply Voltage1-Nom:

    25 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    359 µs

  • Turn-on Time:

    364 µs

  • Width:

    8.89 mm

SID1132K-TL Frequently Asked Questions (FAQs)

  • A 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer is recommended. This helps to dissipate heat efficiently and reduce thermal resistance.
  • Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a suitable thermal interface material (TIM) between the device and the heat sink, and ensure good airflow around the device.
  • The maximum allowed voltage on the BYPASS pin is 6.5V. Exceeding this voltage may damage the device.
  • Yes, the SID1132K-TL can be used in a flyback converter topology. However, ensure that the device is properly configured and the transformer is designed to meet the required specifications.
  • Check the input voltage, enable pin, and feedback pin connections. Ensure that the device is properly configured and that the input voltage is within the recommended range. Use an oscilloscope to verify the voltage waveforms.

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SID1132K-TL Overview

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