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SID1182K-TL - Power Integrations

Description: Gate Drivers Sgl Ch 8.0A Fluxlink 250kHz Delay 260ns

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SID1182K-TL - Power Integrations PCB footprint - Other - Other - SID1182K-TL-2
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SID1182K-TL Details

  • Manufacturer Part Number:

    SID1182K-TL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Power Integrations

  • YTEOL:

    8.1

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G15

  • Length:

    10.16 mm

  • Number of Functions:

    1

  • Number of Terminals:

    15

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Peak Current Limit-Nom:

    8 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP15/16,.46

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.67 mm

  • Supply Current-Max:

    23 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    28 V

  • Supply Voltage1-Min:

    22 V

  • Supply Voltage1-Nom:

    25 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    359 µs

  • Turn-on Time:

    364 µs

  • Width:

    8.89 mm

SID1182K-TL Frequently Asked Questions (FAQs)

  • A 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer is recommended. This helps to dissipate heat efficiently and reduce thermal resistance.
  • Ensure that the device is operated within the recommended temperature range (up to 125°C). Use a suitable thermal interface material (TIM) and ensure good airflow around the device. Also, consider using a heat sink or thermal pad to improve heat dissipation.
  • A low-ESR ceramic capacitor with a value of 10-22 μF is recommended. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ensure stable operation.
  • Check the input voltage, output voltage, and current sense resistor values. Ensure that the device is properly connected and that the input voltage is within the recommended range. Use an oscilloscope to check for oscillations or noise on the output voltage.
  • The maximum allowed output current is 1.8 A. However, the actual output current may be limited by the thermal performance of the device and the PCB design.

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SID1182K-TL Overview

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Part Image SID1182K Power Integrations

Buffer or Inverter Based IGBT/MOSFET Driver, 8A, PDSO15