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SID1183K - Power Integrations

Description: Gate Drivers Sgl Ch 8.0A Fluxlink 75kHz 260ns 1700V

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SID1183K - Power Integrations PCB footprint - Other - Other - SID1183K-2
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SID1183K Details

  • Manufacturer Part Number:

    SID1183K

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    HSOP-16/15

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2017-05-22

  • Manufacturer:

    Power Integrations

  • YTEOL:

    3

  • High Side Driver:

    NO

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G15

  • Length:

    10.16 mm

  • Number of Functions:

    1

  • Number of Terminals:

    15

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Peak Current Limit-Nom:

    8 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP15/16,.46

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Seated Height-Max:

    2.67 mm

  • Supply Current-Max:

    23 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    28 V

  • Supply Voltage1-Min:

    22 V

  • Supply Voltage1-Nom:

    25 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    359 µs

  • Turn-on Time:

    364 µs

  • Width:

    8.89 mm

SID1183K Frequently Asked Questions (FAQs)

  • A 2-layer PCB with a solid ground plane on the bottom layer and a thermal relief pattern on the top layer is recommended. This helps to dissipate heat efficiently and reduces thermal resistance.
  • Ensure that the input voltage rises slowly (dv/dt < 50 V/ms) and the output capacitor is fully discharged before start-up. Also, add a soft-start circuit to limit the inrush current.
  • The SID1183K can withstand voltage stress up to 1.5 times the maximum input voltage rating (Vin_max) for a short duration (< 100 ms). However, it's recommended to keep the voltage stress below Vin_max for reliable operation.
  • Use a low-ESR output capacitor, minimize the output voltage ripple, and ensure the feedback resistors have a high impedance. Also, consider using a low-power mode or a burst-mode operation to reduce standby power consumption.
  • Use a common-mode choke with a ferrite core and a differential-mode inductor with a magnetic core. Add a Y-capacitor (e.g., 1 nF) between the input and output grounds to reduce EMI emissions.

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SID1183K Overview

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Part Image SID1183K-TL Power Integrations

Buffer or Inverter Based IGBT/MOSFET Driver, 8A, PDSO15