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SIJ462DP-T1-GE3 - Vishay

Description: MOSFET 60V Vds 20V Vgs PowerPAK SO-8L

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SIJ462DP-T1-GE3 - Vishay - PCB symbol
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PCB Footprints
SIJ462DP-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK SO-8L Single-1
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3D Models
SIJ462DP-T1-GE3 - Vishay - 3D model - Other - PowerPAK SO-8L Single-1
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SIJ462DP-T1-GE3 Details

  • Manufacturer Part Number:

    SIJ462DP-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SO-8L, 4 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    111 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    20 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    46.5 A

  • Drain-source On Resistance-Max:

    0.008 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSSO-G4

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    100 A

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SIJ462DP-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SIJ462DP-T1-GE3 is a pad layout with a minimum size of 2.5 mm x 2.5 mm, with a 1.5 mm x 1.5 mm thermal pad in the center. This ensures proper heat dissipation and minimizes thermal resistance.
  • While the SIJ462DP-T1-GE3 has a maximum junction temperature of 175°C, it's recommended to operate it at a maximum temperature of 150°C to ensure reliability and longevity. Exceeding this temperature may affect the device's performance and lifespan.
  • To ensure proper soldering, use a soldering iron with a temperature of 260°C to 280°C, and apply a solder paste with a melting point of 217°C to 221°C. Use a reflow oven with a peak temperature of 240°C to 250°C, and follow the recommended soldering profile in the datasheet.
  • The maximum allowed voltage derating for the SIJ462DP-T1-GE3 is 80% of the maximum rated voltage. This means that if the device is rated for 1200 V, the maximum allowed voltage derating would be 960 V.
  • Yes, the SIJ462DP-T1-GE3 can be used in a parallel configuration to increase the overall current handling capability. However, it's essential to ensure that the devices are properly matched and that the thermal management is adequate to prevent overheating.

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SIJ462DP-T1-GE3 Overview

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