SIM-S-IO3-MFF2-2-LP footprint, schematic symbol and 3D model by 1Global

SIM-S-IO3-MFF2-2-LP - 1Global

Description: Remote SIM provisioning compliant with GSMA M2M and SIMalliance specifications; • Inbuilt bootstrap connectivity profile; • Up to 10 operator profiles on a single eSIM; • Compliant with 2G / 3G / 4G (LTE) / CDMA / NB-IoT / CAT–M networks; • Network access applications supported: SIM / USIM / ISIM / CSIM; • Power saving features; • Secure element access control (ARF / PKCS#15); • OTA capability over SMS, CAT-TP & HTTPS (including DNS); • Multi-interfaces able to combine eSIM + eSE.

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Part Number SIM-S-IO3-MFF2-2-LP
Manufacturer 1Global
Pin Count 9
Part Category Integrated Circuit
Package Category Small Outline No-lead
Footprint Name Small Outline No-lead - DFN8 5 × 6 mm
Released Date Aug 1, 2024
Last Modified Date Aug 1, 2024 4:19 AM UTC
Pinout / Pin List Click Here (Member Only)

SIM-S-IO3-MFF2-2-LP Details

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SIM-S-IO3-MFF2-2-LP
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